Intel Corp. disclosed details of its next-generation communications processor strategy, code-named Hermon, which is targeted at single- and dual-mode wideband CDMA phones.
Intel executives said Wednesday (Feb. 25) at the 3GSM World Congress here that the single-chip device incorporates an XScale MSA architecture processor, on-chip StrataFlash memory, W-CDMA and GPRS baseband logic on a 0.13-micron process.
Intel plans to announce full details of the product in the next six months, and expects both mass-market cellphones and smartphones to appear by 2005. Reference designs based on Hermon are expected by the end of the year.
"The fully scalable system-on-chip device incorporates a number of key mobile technologies, such as our Quick Capture and Clear Connect solutions, which will allow handsets to track multiple basestations, thus leading to fewer dropped calls, yet draws on our existing XScale communications processor," said Gadi Singer, vice president and co-general manager of Intel's cellular and hand held group.
The 3G platform will use TTPCom's protocol and applications software, extending the relationship between the companies on GSM/GPRS designs. The first customer for the new communications processor is expected to be Taiwanese group Asustek, which is developing a range of smartphones based on Hermon and Intel's Bulverde applications processor.
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