At a technical conference in Tokyo in early November, Intel said it has identified a new insulator that could be used in PCs, servers, and handheld computers to reduce the leakage of electric current that's forecast to overheat silicon chips in coming years. The insulation material, called "High-K," but which Intel won't identify, could solve the problem of chips' components overheating. Leakage adds expense to computers by requiring large fans and extra air-conditioning in server rooms, draining battery life, and causing lower clock speeds on chips.
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