Most 10-Gbit/s transponders use a 300-pin MSA, but several alternatives are en route. The Xenpak MSA is in place, and systems using Xenpak modules should begin shipping this spring, says Bob Zona, senior product marketing manager of Intel's optical platform division.
Xenpak's size is a handicap, as its development was rushed to accommodate OEMs' product schedules. The smaller XPAK and X2 MSAs will correct the size problem while still splitting 10-Gbit/s feeds into slower parallel streams (see Is Xenpak Past It?).
The TXN18107 was developed by the former LightLogic Inc., acquired by Intel in 2000. Intel expects to be sampling by the end of March and will be showing the module at the upcoming OFC Conference.
Naturally, Intel's not the only XFP player turning up the buzz for OFC. Other companies that have made XFP announcements today -- either entire modules or the critical electronics for modules -- include BitBlitz Communications Inc., Infineon Technologies AG (NYSE/Frankfurt: IFX), and Quake Technologies Inc. Other announcements arrived last week from MergeOptics GmbH and Multilink Technology Corp. (Nasdaq: MLTC), timed to coincide with CeBIT.
Craig Matsumoto, Senior Editor, Light Reading
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